平版印刷术
材料科学
电介质
光电子学
聚酰亚胺
光刻
聚合物
纳米技术
介电损耗
复合材料
作者
Xinhao Nie,Daliao Tao,Zhuo Wang,Song Qiao,Lijun Xiao,Yuhong Chen,H. Li,Xiaojun Peng,Jianhua Zhang
出处
期刊:Polymer Chemistry
[Royal Society of Chemistry]
日期:2026-01-01
卷期号:17 (12): 1210-1221
摘要
Photosensitive polyimides (PSPIs) are critical for advanced packaging but face limitations due to their dielectric performance and lithographic resolution.
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