Analysis of underfill technology for large-scale IRFPA devices

The underfill technology of a large-scale infrared focal plane detector chip is studied. The flow characteristics and principle of filling glue were analyzed. By changing the chip angle, the gap between the detector chip and the readout circuit is filled by fluid capillary action of spontaneous siphon phenomenon, and the incomplete filling caused by the rapid flow of glue around the edge of the chip was avoided at the same time. The formula of filling time of vertical dispensing is given, and the relationship between the process form, design appearance of large-scale infrared focal plane detector chip and dispensing process was analyzed.