3-D Raman Imaging Using Time-Resolving CMOS SPAD Line Sensor and 2-D Mapping

像素 图像传感器 光学 拉曼光谱 CMOS芯片 分光计 材料科学 CMOS传感器 图像分辨率 单光子雪崩二极管 光电子学 物理 探测器 雪崩光电二极管
作者
Belal Mostafa Amin,Jere Kekkonen,Tuomo Talala,Ilkka Nissinen
出处
期刊:IEEE Transactions on Instrumentation and Measurement [Institute of Electrical and Electronics Engineers]
卷期号:72: 1-10 被引量:8
标识
DOI:10.1109/tim.2023.3284953
摘要

The capability of Raman imaging to produce 2D and 3D chemical presentations of samples has gained a lot of interest in different application fields. In this paper, we present a 3D chemical image reconstruction based on 2D scanning of a sample utilizing a time-resolved Raman spectrometer based on a CMOS single-photon avalanche diode (SPAD) line sensor. The 2D scanning data contains the lateral information (XY-plane) whereas the time-of-arrival data of the Raman photons measured by the sensor carries the axial information (i.e., depth information, Z-axis). The sensor is fabricated in 110-nm CMOS technology. It has 256-spectral channels and each channel has its own 7-bit on-chip time-to-digital converter (TDC) with an adjustable resolution from 25 ps to 65 ps. In addition to the 3D chemical reconstruction of the scanned sample, we have also shown the ability to retrieve depth profiling information of each scanned pixel such as the boundaries and middle points of any selected layer over the depth range of the scanned object by means of a single measurement for each scanned pixel. In addition, we have discussed the system components and the post-processing parameters that affect the depth profiling accuracy and the 3D reconstruction operation the most. Results showed that the instrument response function of the system and the time gate window width in a post-processing phase are playing the most important role in determining the axial (depth) accuracy. We believe that our system will enable a whole new class of Raman applications that will allow simultaneous 3D chemical geometric representation at the cm-level during Raman operations.
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