A Design of C-band Miniaturized T/R Module Based on HTCC Multilayer Technology

Based on HTCC multilayer technology and the method of modeling forward simulation design is adopted, the integrated modeling and simulation of the T IR module chip, HTCC interconnect structure and Microstrip- TSV -Stripline transition are carried out, and finally, the T/R module achieves output power>33dBm (30% duty cycle), receive channel gain>25dB and noise figure<2.5dB in the 4GHz-8GHz band. The volume of the T/R module is only 13mm ^x 15mm ^x 2.6mm.