High performances of polyimide/boron nitride nanosheets composites via integrative interfacial decoration strategy

With the rapid development of electrical equipment and integrated circuits, packaging materials with high heat dissipation capability are in great demand. Reducing the interfacial thermal resistance is still a great challenge in polymeric composites. Herein, surface-induced polyamide acid (PAA) polymerization on boron nitride nanosheets (BNNSs) was firstly achieved, and then the BNNS@PAA was introduced into the polymerization system of polyimide (PI). The dependence of microstructures and performances of the composites on imidization degree of BNNS@PAA was systematically investigated. The results show that there is an appropriate imidization temperature (120 °C), at which the composite with only 10 wt% BNNS@PAA exhibits high thermal conductivity (2.11 W/m·K), excellent mechanical properties (with tensile strength of 97.2 MPa and elongation at break of 19.8%), and good dielectric properties (with a discharged energy density of 3.67 J/cm 3 and a charge-discharge efficiency of 87.4% at the field of 300 MV/m).