材料科学
聚酰亚胺
氮化硼
复合材料
硼
六方氮化硼
石墨烯
纳米技术
图层(电子)
有机化学
化学
作者
Chenyu Li,Ting Gu,Dong Sun,Xiao‐dong Qi,Chaoxia Zhao,Yifeng Lei,Yong Wang
标识
DOI:10.1016/j.compscitech.2022.109681
摘要
With the rapid development of electrical equipment and integrated circuits, packaging materials with high heat dissipation capability are in great demand. Reducing the interfacial thermal resistance is still a great challenge in polymeric composites. Herein, surface-induced polyamide acid (PAA) polymerization on boron nitride nanosheets (BNNSs) was firstly achieved, and then the BNNS@PAA was introduced into the polymerization system of polyimide (PI). The dependence of microstructures and performances of the composites on imidization degree of BNNS@PAA was systematically investigated. The results show that there is an appropriate imidization temperature (120 °C), at which the composite with only 10 wt% BNNS@PAA exhibits high thermal conductivity (2.11 W/m·K), excellent mechanical properties (with tensile strength of 97.2 MPa and elongation at break of 19.8%), and good dielectric properties (with a discharged energy density of 3.67 J/cm 3 and a charge-discharge efficiency of 87.4% at the field of 300 MV/m).
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