形状记忆聚合物
形状记忆合金
材料科学
共价键
聚合物
聚酰亚胺
复合材料
氢键
智能聚合物
离解(化学)
玻璃化转变
智能材料
动态力学分析
变形(气象学)
拉伤
热的
氢
热分解
执行机构
网络共价键合
耐热性
形状变化
纳米技术
粘弹性
应变率
化学物理
可塑性
化学键
分子
分子动力学
形状记忆合金*
作者
Xiuting Li,Xinyan Zhou,Rui Shang,Qingsong Xu,Jie Dong,Xin Zhao,Qinghua Zhang
标识
DOI:10.1016/j.aiepr.2025.09.014
摘要
High-temperature shape memory polymers (SMPs) often face inherent trade-offs between strain capacity and thermal stability. To address this challenge, we develop a novel shape memory polyimide (SMPI) that concurrently achieves record-breaking high temperature resistance and shape memory performance with a glass transition temperature ( T g ) exceeding 230°C, recoverable strain capabilities surpassing 450%, and shape recovery higher than 99.5%. This optimal performance balance stems from the synergistic interplay of molecular chain flexibility, dynamic hydrogen bonds, and covalent cross-linking networks. Molecular simulations and experimental analyses reveal the cooperative mechanisms between dynamic hydrogen bonds and covalent networks. Specifically, upon thermal activation, temperature-dependent dynamic hydrogen bonds dissociate, facilitating large-strain deformability. Conversely, upon cooling, their recombination restricts polymer chain mobility, enhancing shape fixity. Concurrently, the covalent cross-linking network suppresses plastic deformation during shape programming and accelerates shape recovery. Furthermore, we engineered polyimide fiber-reinforced SMPI composites that exhibited two-way shape memory behavior with 100% cyclic retention over 10 cycles, demonstrating their potential to be applied in aerospace actuators and intelligent robots in extreme environments. Covalent/noncovalent dual-network polyimides achieve 450% recyclable strain at >230°C with 100% recovery over 10 cycles, reducing polymer waste in smart shape-shifting devices. • SMPI show transformative T g exceeding 230°C with remarkable 450% strain. • Temperature-dependent hydrogen bonds enable large-strain deformability and high shape fixity by modulating dissociation and recombination. • The covalent crosslinking network suppresses plastic deformation during programming and drives entropy-driven shape recovery. • Two-way shape memory SMPI composites achieve 100% recovery rate over 10 cycles.
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