Shape memory polyimides with large strain and high temperature resistance based on covalent-noncovalent dual-crosslinked networks

形状记忆聚合物 形状记忆合金 材料科学 共价键 聚合物 聚酰亚胺 复合材料 氢键 智能聚合物 离解(化学) 玻璃化转变 智能材料 动态力学分析 变形(气象学) 拉伤 热的 热分解 执行机构 网络共价键合 耐热性 形状变化 纳米技术 粘弹性 应变率 化学物理 可塑性 化学键 分子 分子动力学 形状记忆合金*
作者
Xiuting Li,Xinyan Zhou,Rui Shang,Qingsong Xu,Jie Dong,Xin Zhao,Qinghua Zhang
出处
期刊:Advanced industrial and engineering polymer research [Elsevier BV]
卷期号:9 (1): 137-146 被引量:1
标识
DOI:10.1016/j.aiepr.2025.09.014
摘要

High-temperature shape memory polymers (SMPs) often face inherent trade-offs between strain capacity and thermal stability. To address this challenge, we develop a novel shape memory polyimide (SMPI) that concurrently achieves record-breaking high temperature resistance and shape memory performance with a glass transition temperature ( T g ) exceeding 230°C, recoverable strain capabilities surpassing 450%, and shape recovery higher than 99.5%. This optimal performance balance stems from the synergistic interplay of molecular chain flexibility, dynamic hydrogen bonds, and covalent cross-linking networks. Molecular simulations and experimental analyses reveal the cooperative mechanisms between dynamic hydrogen bonds and covalent networks. Specifically, upon thermal activation, temperature-dependent dynamic hydrogen bonds dissociate, facilitating large-strain deformability. Conversely, upon cooling, their recombination restricts polymer chain mobility, enhancing shape fixity. Concurrently, the covalent cross-linking network suppresses plastic deformation during shape programming and accelerates shape recovery. Furthermore, we engineered polyimide fiber-reinforced SMPI composites that exhibited two-way shape memory behavior with 100% cyclic retention over 10 cycles, demonstrating their potential to be applied in aerospace actuators and intelligent robots in extreme environments. Covalent/noncovalent dual-network polyimides achieve 450% recyclable strain at >230°C with 100% recovery over 10 cycles, reducing polymer waste in smart shape-shifting devices. • SMPI show transformative T g exceeding 230°C with remarkable 450% strain. • Temperature-dependent hydrogen bonds enable large-strain deformability and high shape fixity by modulating dissociation and recombination. • The covalent crosslinking network suppresses plastic deformation during programming and drives entropy-driven shape recovery. • Two-way shape memory SMPI composites achieve 100% recovery rate over 10 cycles.
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