阈值电压
材料科学
光电子学
氮化镓
热离子发射
晶体管
宽禁带半导体
肖特基二极管
肖特基势垒
金属浇口
栅氧化层
电压
电气工程
电子
图层(电子)
二极管
物理
纳米技术
工程类
量子力学
标识
DOI:10.1109/iirw49815.2020.9312869
摘要
In this study, the transient threshold voltage behavior of p-GaN capped AlGaN/GaN high-electron-mobility transistors (HEMTs) is evaluated, by monitoring the threshold voltage from 10 μs up to 100 s during positive gate bias stress, as well as during recovery. It is found that the threshold voltage transients are highly dependent on the current distribution in the metal/p-GaN/AlGaN/GaN gate stack. Two different gate processes are evaluated in terms of ON-state gate current, gate conduction mechanism and threshold voltage stability. Devices with perimeter-dependent gate current show large threshold voltage shifts; devices in which the gate current is due to uniform thermionic (field) emission over the Schottky interface into the bulk p-GaN demonstrate stable behavior for V g <; 5 V.
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