光学
干涉测量
计量学
材料科学
连贯性(哲学赌博策略)
傅里叶变换
摄影术
微加工
光学相干层析成像
衍射
纵横比(航空)
图像分辨率
数值孔径
分辨率(逻辑)
相位恢复
复合数
相(物质)
光圈(计算机存储器)
轮廓仪
表征(材料科学)
天文干涉仪
空间频率
傅里叶变换光谱学
相干长度
白光干涉法
尺寸计量学
迭代重建
作者
Yin Li,Qun Yuan,Xiao Huo,Shumin Wang,Hongtao He,Zhishan Gao
标识
DOI:10.1038/s41377-026-02189-6
摘要
Non-destructive and accurate characterization of high aspect ratio (HAR) and composite micro-trenches is critical for advanced microfabrication but remains a major challenge. Conventional coherence scanning interferometry (CSI), while widely adopted, suffers from low signal-to-noise ratio (SNR) and limited lateral resolution when applied to HAR and composite microstructures. Here, we present Fourier ptychographic coherence scanning interferometry (FP-CSI), the first transmissive CSI modality that integrates the aperture synthesis strategy of Fourier ptychographic microscopy with the quantitative phase-resolved capability of interferometry. FP-CSI enables robust three-dimensional morphology reconstruction with enhanced SNR and improved lateral resolution, without reliance on iterative phase retrieval. We demonstrate accurate measurements of a HAR micro-trench (300 μm depth, 30:1 aspect ratio) and micro-electro-mechanical system (MEMS) devices (aspect ratios 6:1-20:1). FP-CSI achieves lateral resolution up to the incoherent diffraction limit and maintains this performance even at trench bottoms. Owing to its fidelity, robustness, and non-destructive operation, FP-CSI provides a powerful new metrology platform for next-generation semiconductor inspection, precision manufacturing, and emerging micro-optoelectronic systems.
科研通智能强力驱动
Strongly Powered by AbleSci AI