材料科学
光电子学
蚀刻(微加工)
光电探测器
响应度
金属有机气相外延
对接接头
平面的
光学
放大器
半导体
共发射极
外延
图层(电子)
纳米技术
物理
冶金
计算机图形学(图像)
CMOS芯片
计算机科学
作者
Feng Xiao,Qin Han,Han Ye,Shuai Wang,Zi-Qing Lu,Fan Xiao
出处
期刊:Chinese Physics B
[IOP Publishing]
日期:2021-09-16
卷期号:31 (4): 048101-048101
被引量:2
标识
DOI:10.1088/1674-1056/ac272b
摘要
We have realized integration of evanescent wave coupled photodetector (ECPD) and multi-quantum well (MQW) semiconductor optical amplifier (SOA) on MOCVD platform by investigating butt-joint regrowth method of thick InP/InGaAsP waveguides to deep etched SOA mesas. The combination of inductively coupled plasma etching and wet chemical etching technique has been studied to define the final mesa shape before regrowth. By comparing the etching profiles of different non-selective etchants, we have obtained a controllable non-reentrant mesa shape with smooth sidewall by applying one step 2HBr:2H 3 PO 4 :K 2 Cr 2 O 7 wet etching. A high growth temperature of 680 °C is found helpful to enhance planar regrowth. By comparing the growth morphologies and simulating optical transmission along different directions, we determined that waveguides should travel across the regrowth interface along the [110] direction. The relation between growth rate and mask design has been extensively studied and the result can provide an important guidance for future mask design and vertical alignment between the active and passive cores. ECPD-SOA integrated device has been successfully achieved by this method without further regrowth steps and provided a responsivity of 7.8 A/W. The butt-joint interface insertion loss is estimated to be 1.05 dB/interface.
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