材料科学
耐久性
结温
焊接
可靠性(半导体)
绝缘栅双极晶体管
功率密度
热导率
功率(物理)
复合材料
电气工程
电压
量子力学
物理
工程类
作者
Toshiyuki Furukawa,Masaki Shiraishi,Yoshitaka Yasuda,Akitoyo Konno,M. Mori,Toshiaki Morita,Sou Watanabe,Takao Arai,Masato Nakamura,Daisuke Kawase
标识
DOI:10.23919/ispsd.2017.7988910
摘要
In this study, sintered Cu is shown to have superior reliability to that of sintered Ag, in a high-temperature thermal cycle test up to 200°C and superior power cycle durability at a maximum junction temperature of 175°C. A 1700 V low-stray-inductance dual module made with sintered Cu and a leading-edge side-gate HiGT (High-conductivity IGBT) is also shown to have high power density with low loss and ten times higher power cycle durability compared with Pb-rich solder.
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