Minimization of thickness of ultrasonic transducer by using piezoelectric backing layer

Abstract To realize an insertion transducer with broadband characteristic, a transducer with a piezoelectric backing layer is proposed. The characteristic of the transducer was analyzed by using an equivalent circuit for a different electrical impedance connected to the piezoelectric backing layer. In the transducer designed to achieve optimization, the thickness of the transducer is less than 2.4 times that of the driving piezoelectric layer, and the frequency bandwidth is more than 110%. It is confirmed that the bandwidth of the fabricated transducer can be controlled by adjusting the electrical impedance in the piezoelectric backing layer.