薄脆饼
硅
材料科学
集成电路
放大器
电子线路
半导体
电子工程
光电子学
数码产品
计算机科学
纳米技术
机械工程
电气工程
工程类
CMOS芯片
作者
Dae‐Hyeong Kim,Jong‐Hyun Ahn,Won Mook Choi,Hoon‐Sik Kim,Tae‐Ho Kim,Jizhou Song,Yonggang Huang,Zhuangjian Liu,Chao Lu,John A. Rogers
出处
期刊:Science
[American Association for the Advancement of Science]
日期:2008-03-28
卷期号:320 (5875): 507-511
被引量:1655
标识
DOI:10.1126/science.1154367
摘要
We have developed a simple approach to high-performance, stretchable, and foldable integrated circuits. The systems integrate inorganic electronic materials, including aligned arrays of nanoribbons of single crystalline silicon, with ultrathin plastic and elastomeric substrates. The designs combine multilayer neutral mechanical plane layouts and "wavy" structural configurations in silicon complementary logic gates, ring oscillators, and differential amplifiers. We performed three-dimensional analytical and computational modeling of the mechanics and the electronic behaviors of these integrated circuits. Collectively, the results represent routes to devices, such as personal health monitors and other biomedical devices, that require extreme mechanical deformations during installation/use and electronic properties approaching those of conventional systems built on brittle semiconductor wafers.
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