Establishment of a growth route of crystallized rutile GeO2 thin film (≧1 μm/h) and its structural properties

Recently, rutile germanium dioxide (r-GeO2) has emerged as a novel ultra-wide bandgap semiconductor due to its theoretical excellent properties, that is, high thermal conductivity, ambipolar dopability, and high carrier mobility, in addition to its wide bandgap (4.44–4.68 eV). In this study, r-GeO2 thin films were grown on (001) r-TiO2 substrates by mist chemical vapor deposition. To optimize the growth conditions, we analyzed the decomposition processes of the Ge source (C6H10Ge2O7) by thermogravimetry-differential thermal analysis. It is found that GeO2 was synthesized from C6H10Ge2O7 at 553–783 °C in aqueous vapor. We accomplished fabrication of (001)-oriented r-GeO2 on r-TiO2 with a growth rate of 1.2–1.7 μm/h. On the other hand, under lower growth rate conditions (50 nm/h), the full width at half maximum of the r-GeO2 002 peak remarked a relatively small value of 560 arc sec. In addition, clear diffraction spots of r-GeO2 and r-TiO2 were observed at the r-GeO2/r-TiO2 interface, and the film was found to be significantly strained along the in-plane direction (∼2.3%) by cross-sectional transmission electron microscopy. The growth rate of ≧1 μm/h must contribute to the fabrication of thick r-GeO2 films, which can be utilized as power electronics devices with high breakdown voltage.