期刊:Institution of Engineering and Technology eBooks [Institution of Engineering and Technology] 日期:2015-01-01卷期号:: 139-190
标识
DOI:10.1049/pbcs028e_ch4
摘要
In this chapter, we will review major active cooling mechanisms and the types of support they receive from sensors. The discussion will start with the most common and perhaps least sophisticated of all active cooling techniques, which is air cooling. Liquid cooling has found commercial use in select processor chips used in HPC systems, for example, supercomputers. Finally, the emerging field of thermoelectric cooling will be discussed.