Progress in the application and preparation of refractory metal alloy targets for integrated circuits

With the rapid development of integrated circuit technology, the performance requirements of thin film materials are becoming more and more stringent, and refractory metal alloy targets show greater application value, especially tungsten alloy and molybdenum alloy sputtering targets as a typical representative. This paper focuses on tungsten alloy and molybdenum alloy targets, presenting the latest applications of these alloy targets in large-scale integrated circuits. It further analyzes the correlation between sputtering target performance and deposited film quality. Finally, it reviews the progress in preparing refractory metal alloy targets and outlines future prospects.