材料科学
薄膜晶体管
印刷电子产品
柔性电子器件
电介质
薄膜
纳米技术
有机电子学
介电常数
数码产品
电压
复合材料
光电子学
图层(电子)
电气工程
晶体管
工程类
墨水池
作者
Hyeok‐jin Kwon,Benliang Hou,Hong Nhung Le,Heqing Ye,Song-Hee Lee,Hoyoul Kong,Xiaowu Tang,Xinlin Li,Ju‐Young Kim,Se Hyun Kim
标识
DOI:10.1002/adfm.202503123
摘要
Abstract Two new organic–inorganic (O–I) hybrid materials are synthesized and used as insulating layers for thin‐film and fully printed electronics using non‐vacuum, low‐temperature processing. The O–I hybrid materials are composed of high‐permittivity (high‐k) oxide components, ZrO₂ and TiO₂, combined with organic three‐arm structured amphiphilic components. These materials, designated as UZr and UTi, exhibited dielectric constants (k) of 12.43 and 17.33, respectively. Thin films made of both materials exhibited smooth surfaces, good insulating performance, and excellent mechanical flexibility; however, their morphologies varied depending on the specific oxide component. Thin‐film transistors (TFTs) fabricated with UZr and UTi layers demonstrate outstanding electrical performances under low‐voltage conditions (≈2 V). However, distinct driving/hysteresis behavior is observed owing to the differences in their morphological and dielectric properties between UZr and UTi. The variations in their dielectric behavior render these materials suitable for use in different types of devices, including transistors, memory devices, and integrated printed electronics. This straightforward synthetic strategy for producing high‐k O–I hybrid materials paves a new pathway for the development of advanced materials for thin films and printed electronics.
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