钎焊
蓝宝石
材料科学
微观结构
钛
润湿
复合材料
图层(电子)
抗剪强度(土壤)
填充金属
冶金
金属
焊接
激光器
光学
物理
环境科学
电弧焊
合金
土壤科学
土壤水分
作者
Yi Zhou,Hong Bian,Xiaoguo Song,Yuzhen Lei,Mingjun Sun,Weimin Long,Sujuan Zhong,Lianhui Jia
出处
期刊:Crystals
[Multidisciplinary Digital Publishing Institute]
日期:2022-11-22
卷期号:12 (12): 1687-1687
被引量:6
标识
DOI:10.3390/cryst12121687
摘要
In this study, C-plane (0001) sapphire was successfully brazed to titanium using AuSn20 filler metal, following metallization on the surface of the sapphire with Sn-3Ti (wt.%). At 1000 °C, Sn-3Ti had good wettability on the surface of the sapphire, with the lowest equilibrium contact angle of 57°. The reaction phases in the joints were identified, and the typical interfacial microstructure of the brazed joint brazed at 550 °C for 30 min was titanium substrate/Au-Sn-Ti layer/Ti6Sn5 + AuSn2 + AuSn4 + massive Au-Sn-Ti/TiO phase/sapphire. The shear test was utilized to evaluate the bonding strength of the titanium/sapphire joints. The highest shear strength reached 18.7 MPa when brazed at 550 °C for 35 min. The crack was initiated at the sapphire/brazing seam interface and propagated into the Au-Sn-Ti reaction layer.
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