Synthesis and high-temperature energy storage performances of fluorinated polyimides

In light of the increasingly stringent requirements for the applications of light-weight flexible high-temperature-resistant dielectric materials in the fields of aerospace, electronics, and electric vehicles, the imperative lies in the development of dielectric materials with high discharged energy density, enduring temperature resistance and high reliability. This work introduced side-chain trifluoromethyl (–CF3) groups into high-temperature engineering polymer polyimides and conducted comprehensive studies on the breakdown and energy storage capabilities. The introduction of bulky –CF3 substituents reduces the intermolecular interactions, increases the free volume, and suppresses the high-temperature leakage conductance loss by decreasing the formation of intermolecular charge transfer complexes between polymer chains. As a result, the fluorinated polyimides (PFI) with lower dielectric constant exhibit enhanced breakdown strengths (730 MV m−1 at 25 °C; 630 MV m−1 at 150 °C), leading to a high discharged energy density of 3.6 J cm−3 (∼1.7 times of pristine polyimides), alongside a charge-discharge energy efficiency of ∼80% at 150 °C. These findings underscore the great potential of PFI for applications in the field of high-temperature energy storage.