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Evolution and Analysis of GaN GAA FET Induced High-K Spacer Wrapped Gate Underlap for Superfast Circuitry and RF Applications

作者
Sneha Singh,P. Indra Devi,Rudra Sankar Dhar,Mousa Hussein,Falah Awwad
出处
期刊:IEEE Access [Institute of Electrical and Electronics Engineers]
卷期号:13: 160221-160237
标识
DOI:10.1109/access.2025.3608819
摘要

Gallium Nitride (GaN) Gate-All-Around (GAA) FETs are developed to be promising candidates for high-frequency, superfast circuitry and RF applications mainly due to their superior electron mobility and wide bandgap. A variety of GaN GAA FETs are developed incorporating gate underlap, spacer technology and source/drain engineering. A comprehensive analysis of DC and AC/RF performance parameters of high-k spacer-wrapped underlap-induced GaN GAA FETs with source and drain enlargements are attained. The impact of this spacer engineering on threshold voltage (Vth), drain-induced barrier lowering (DIBL), subthreshold swing (SS), ON-current (IOn), leakage current (IOff), and switching speed (IOn/IOff) are systematically evaluated. It is inevitably determined that integrating a high-K spacer substantially improves electrostatic control, thereby mitigates short-channel effects while achieve a near ideal SS of ~62 mV/decade. A refined underlap design with high-k wrapping effectively subdues fringing field effects by reducing parasitic capacitances and resistances acquiring cut-off frequency of ~7.2 THz, improves AC performances. The underlap region suppresses DIBL, maintaining excellent gate control while achieving a higher IOn/IOff ratio of $\sim 19 \times 10 ^{8}$ instigating development of the novel device for superfast circuitry applications. The analysis is calibrated and validated with experimentally fabricated devices while Vth is analytically modelled. Comparison with existing research and proposed IRDS 2028 of 1.5 nm technology node shows the underlap-induced GaN GAA FET is advantageous, highlighting its effectiveness in reducing power dissipation, and enhancing switching performance. These findings confirm the design is well-suited for next-generation low-power, high-performance, superfast circuitry and RF applications offering superior energy efficiency and reliability in ultra-scaled transistor architectures.

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