Heat Transfer Contributions of Pins and Endwall in Pin-Fin Arrays: Effects of Thermal Boundary Condition Modeling

传热 机械 翼型 热的 材料科学 传热系数 涡轮机 强化传热 升华(心理学) 热力学 机械工程 物理 工程类 复合材料 心理学 心理治疗师
作者
Minking K. Chyu,Y. C. Hsing,T. I‐P. Shih,V. Natarajan
出处
期刊:Volume 3: Heat Transfer; Electric Power; Industrial and Cogeneration 被引量:126
标识
DOI:10.1115/98-gt-175
摘要

Short pin-fin arrays are often used for cooling turbine airfoils, particularly near the trailing edge. An accurate heat transfer estimation from a pin-fin array should account for the total heat transfer over the entire wetted surface which includes the pin surfaces and uncovered end walls. One design question frequently raised is the actual magnitudes of heat transfer coefficients on both pins and endwalls. Results from earlier studies have led to different and often contradicting conclusions. This variation, in part, is caused by imperfect or unrealistic thermal boundary conditions prescribed in the individual test models. Either pins or endwalls, but generally not both, were heated in those previous studies. Using a mass transfer analogy based on the naphthalene sublimation technique, the present experiment is capable of revealing the individual heat transfer contributions from pins and endwalls with the entire wetted surface thermally active. The particular pin-fin geometry investigated, S/D = X/D = 2.5 and H/D = 1.0, is considered to be one of the optimal array arrangement for turbine airfoil cooling. Both inline and staggered arrays with the identical geometric parameters are studied for 5,000 ≤ Re ≤ 25,000. The present results reveal that the general trends of the row-resolved heat transfer coefficients on either pins or endwalls are somewhat insensitive to the nature of thermal boundary conditions prescribed on the test surface. However, the actual magnitudes of heat transfer coefficients can be substantially different, due to variations in the flow bulk temperature. The present study also concludes that the pins have consistently 10 to 20% higher heat transfer coefficient than the endwalls. However, such a difference in heat transfer coefficient imposes very insignificant influence on the overall array-averaged heat transfer, since the wetted area of the uncovered endwalls is nearly four times greater than that of the pins.
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