Crystallographic Factors in High-Rate Anodic Dissolution of Copper

Surface textures resulting from the anodic dissolution of polycrystalline and single crystal copper at have been studied. Electrolyte flow velocities of 2500 and 400 cm/sec have been used for dissolution in the active and transpassive mode. Results obtained by light and electron microscopy show that surface topography resulting from active dissolution depends on crystal orientation. Flow streaks appear in transpassive dissolution. Transpassive pitting was observed in polycrystalline samples only.