薄脆饼
德拉姆
材料科学
晶片键合
平坦度(宇宙学)
晶圆回磨
钝化
模具准备
光电子学
互连
过程控制
电子工程
晶片切割
过程(计算)
纳米技术
图层(电子)
计算机科学
工程类
计算机网络
物理
宇宙学
量子力学
操作系统
作者
Jin-Won Park,Byung-Ho Lee,Heesun Lee,Dail Lim,Jiho Kang,Changhyun Cho,Myung-Hee Na,Ilsup Jin
标识
DOI:10.1109/ectc51906.2022.00030
摘要
This study proves the applicability of wafer to wafer hybrid bonding to commercialized DRAM products for the first time. A metal interconnection process for bonding Cu pad was carried out on the already fabricated DRAM wafer and another bare Si wafer. Two wafers were stacked with wafer to wafer hybrid bonding process. Afterwards, TSV last process with BEOL Metallization was carried out. After applying the optimized bonding process conditions with CMP flatness, Cu dishing control, bonding voids free was confirmed. The stable connectivity of bonding could be confirmed through the daisy chain pattern with 100% pass rate. Finally same wafer yields with current DRAM product can be obtained. Cell characteristics have changed as the hydrogen passivation effect due to the hybrid bonding process and subsequent metal processes has changed. Through thermal budget control, the same cell characteristics could be obtained as existing DRAM.
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