热导率
导电体
材料科学
数码产品
制作
热的
纳米技术
导电聚合物
热阻
工程物理
复合材料
聚合物
电气工程
工程类
物理
气象学
病理
替代医学
医学
作者
Chang‐Ping Feng,Wei Fang,Kai-Yin Sun,Yan Wang,Hongbo Lan,Hongjing Shang,Fazhu Ding,Lu Bai,Jie Yang,Wei Yang
标识
DOI:10.1007/s40820-022-00868-8
摘要
Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.
科研通智能强力驱动
Strongly Powered by AbleSci AI