Study of the Kinetics of Adhesive Bond Formation Using the Ultrasonic Method

胶粘剂 材料科学 复合材料 粘结强度 极限抗拉强度 超声波传感器 动力学 声学 量子力学 物理 图层(电子)
作者
Jakub Kowalczyk,Marian Jósko,Daniel Wieczorek,Kamil Sędłak,Michał Nowak
出处
期刊:Applied sciences [Multidisciplinary Digital Publishing Institute]
卷期号:14 (1): 163-163 被引量:4
标识
DOI:10.3390/app14010163
摘要

Adhesive bonding is widely used in modern industry. It has many advantages—the main one being the reduction in production costs. It also has certain limitations. One of the limitations of adhesive bonds is the relatively long bonding time of the joints. The main objective of this research was to determine the possibility of studying the kinetics of adhesive bond formation using a non-destructive ultrasonic method. A research experiment was planned and carried out. Adhesive specimens were prepared, and their quality changes over time were evaluated. In addition, the change in ultrasonic measures during the testing of these bonds was evaluated, as well as the hardness of the adhesive. In this study, the choice of test apparatus was made, in particular ultrasonic probes for the adhesive used and the materials to be bonded. The choice of adhesive was also made, for one in which bonding phenomena occur uniformly throughout the volume. This work examined the changes in the mechanical strength and hardness with time. The tests showed that the greatest changes in mechanical strength occur within the first 24 h after the bond was made. With the mechanical strength reaching 12.6 Mpa after 216 h, the strength in the first 24 h was 10.36 (for bonded steel sheets). For bonded steel discs, the maximum tensile strength was 26.99 Mpa (after 216 h), with a hardness of 22.93 Mpa during the first 24 h. Also, significant changes were observed in the adhesive hardness during the first 24 h. The hardness of the adhesive after 216 h was 70.4 Shore’a on the D scale, while after 24 h it was 69.4 Shore’a on the D scale. Changes in the ultrasonic parameters of the adhesive bond quality were found to occur along with changes in the bond quality.
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