数码产品
物联网
多输入多输出
计算机科学
电信
嵌入式系统
工程类
电气工程
波束赋形
作者
Theodore W. Callis,Kexin Hu,H. Jamal,Manos M. Tentzeris
标识
DOI:10.1142/s0129156424400664
摘要
This review encompasses additive manufacturing techniques for crafting 5G electronics, showcasing how these methods innovate device creation with novel examples. A wearable phased array device on commonplace 3D printed material is described, with integrated microfluidic cooling channels used for thermal regulation of integrated circuit bulk components. Mechanical and electrical tunability are exemplified in an origami-inspired phased array structure. A 3D printed IoT cube structure shows the flexibility in the number of geometries additively manufactured 5G devices can adhere to. Finally, integrating 3D optical lenses with 5G electronics is shown.
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