OS14-3 Adhesion of Thin Film for Electronic Package at Elevated Temperature(Semiconductor Devices and Electronic Packaging 1,OS14 Electronic and photonic packages,APPLICATIONS)
作者
In-Suh Son,Dong-Kil Shin
出处
期刊:Abstracts of ATEM [The Japan Society of Mechanical Engineers] 日期:2015-01-01卷期号:2015.14: 209-209