抛光
磨料
材料科学
化学机械平面化
Atom(片上系统)
化学工程
复合材料
冶金
计算机科学
工程类
嵌入式系统
作者
Yuqi Zhou,Kezhong Xu,Yuhan Gao,Ziniu Yu,Fulong Zhu
摘要
Two different modes of material removal are defined based on the difference in the mode of atom removal, i.e. , mechanical removal and removal associated with interfacial bonding.
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