极紫外光刻
镜头(地质)
数值孔径
计算机科学
极端紫外线
钥匙(锁)
光圈(计算机存储器)
覆盖
扫描仪
吞吐量
光学(聚焦)
光学
焦点深度(构造)
高分辨率
人工智能
物理
工程类
无线
激光器
电信
机械工程
操作系统
遥感
俯冲
波长
地质学
构造学
古生物学
生物
作者
Jan van Schoot,Sjoerd Lok,Eelco van Setten,Ruben Maas,Rudy Peeters,Jo Finders,Judon M. D. Stoeldraijer,Jos P. H. Benschop,Paul Graeupner,Peter Kuerz,Thomas Stammler,Kars Troost
出处
期刊:
日期:2021-09-27
卷期号:: 26-26
被引量:5
摘要
While EUV systems equipped with a 0.33 Numerical Aperture (NA) lens are being applied in high volume manufacturing, ASML and ZEISS are in parallel ramping up their activities on an EUV exposure tool with an NA of 0.55. The purpose of this so-called high-NA scanner, targeting an ultimate resolution of 8nm, is to extend Moore’s law for another decade. A novel lens design, capable of providing the required Numerical Aperture, has been identified; this so called anamorphic lens will provide 8nm resolution in all orientations. Paired with new, faster stages and more accurate sensors providing the tight focus and overlay control needed it enables future nodes. In this paper we will outline the advantages of High-NA, especially for managing the needed extreme low defect printing rates while maximizing the effective throughput for patterning economics. The imaging performance is being simulated based on expected surface figures of the illumination and projection optics. Next to this, an update will be given on the status of the developments at ZEISS and ASML. Buildings, cleanrooms and equipment are being constructed, mirror production is ramping up, many tests are carried out to ensure a smooth implementation.
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