Multilayer Soft PCBs via Laser Patterning and Solvent‐Assisted Interface Engineering

Soft-matter electronics offer compelling opportunities for digital health, soft robotics, and interactive systems; however, their translation beyond laboratory remains limited by the absence of fabrication approaches that achieve PCB-like circuit resolution, reliable microchip integration, and multilayer interconnects, while preserving mechanical compliance, stretchability, and ultralow thickness. We present a scalable fabrication platform for high-resolution, multilayer soft-PCBs that combines solvent-mediated interfacial engineering on reversible polymers, material-selective laser-assisted patterning with feature sizes down to ∼25 µm, laser-assisted VIA formation, and biphasic liquid-metal-based conductive composites. We introduce Vapor-Assisted MicrochiP Integration and layER fusion (VAMPIER), a unified process enabling both microchip attachment and multilayer lamination. VAMPIER exploits solvent-induced interfacial softening for layer bonding (SolBond) and microchip soldering (SolSolder). VAMPIRE induces a transient transform of physically cross-linked elastomers into a gel state, promoting conformal contact, interlayer fusion, and robust electrical coupling. This results in low-resistance microchip pad-to-interconnect junctions and reliable VIA connections without thermal soldering. A planarization strategy ensures layer flatness prior to fusion, improving yield and interconnect reliability. All fabrication steps are performed below 60°C, enabling compatibility with soft polymers and surface-mount devices. This platform enables multilayer, microchip-integrated soft-PCBs approaching rigid PCB standards in resolution and density, while offering superior mechanical resilience and sustainability.