NAND Flash technology status and perspectives

This chapter reviews the current NAND Flash technology status and future directions. The fundamental NAND Flash structure, device, and array operation principles will be discussed for both 2D and 3D NAND Flash devices. Different types of 3D-NAND Flash memories, floating-gate-based and charge-trap-based are being mass produced today and will be reviewed and compared. From an architectural point of view, there are two mainstream approaches as well, one approach using CMOS under the array (CUA) while the more conventional approach is using CMOS next to the array (CNA). Future scaling of 3D-NAND Flash memories and its challenges will be discussed in detail and the chapter will end with a discussion on future applications for 3D-NAND Flash memories.