Continuous plating/stripping behavior of solid-state lithium metal anode in a 3D ion-conductive framework

Significance Solid-state lithium metal anode possesses great promise owing to its high energy density and improved safety. This work introduces a strategy for constructing a 3D Li metal anode, which is hosted in a solid-state ion-conducting host and shows a safe and dendrite-free plating/stripping behavior. The host is based on a garnet-type ion-conductive framework and a bottom-deposited Cu current collector. The Li anode is plated within the solid garnet framework from the bottom Cu layer and shows a dendrite-free deposition behavior, effectively averting the dendrite penetration issue. Owing to the 3D ion-conductive host, the volume change and interface contact problem of the Li anode have been significantly mitigated, realizing a high-capacity and safe Li metal anode for solid-state high-energy-density batteries.