材料科学
异质结
兴奋剂
光电子学
无定形固体
接触电阻
电阻率和电导率
薄板电阻
工程物理
等效串联电阻
电气工程
纳米技术
化学
工程类
电压
有机化学
图层(电子)
作者
D. Lachenal,Derk Bäetzner,W. Frammelsberger,B. Legradic,J. Meixenberger,P. Papet,B. Strahm,G. Wahli
标识
DOI:10.1016/j.egypro.2016.07.104
摘要
High fill factor value is still a hot topic in Heterojunction (HJT) solar cells. Despite major improvement regarding the metallization losses using a novel encapsulation scheme like the SmartWire approach [1], the other series resistance contributions are still difficult to evaluate. Contacts between amorphous doped layers and transparent conducting oxides remain the main electrical barriers for both electrons and holes carriers. This work focuses on the series resistance breakdown of a high efficiency 6 inches HJT cell (eta=22.4%, FF=80.3%, Voc=738 mV, Jsc=37.8 mA/cm2) by comparing first two different existing methods to extract the series resistance, the European Standard EN60891 and the SunVoc. We present then two TLM (Transfer Length Method) dedicated structures to extract both the a-Si:H(n)/TCO and a-Si:H(p)/TCO contact resistivity. This enables us to rank each contribution of the series resistance from interfaces, TCO sheet resistance and the final metallization.
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