Investigating on Through Glass via Based RF Passives for 3-D Integration

Due to low dielectric loss and low cost, glass is developed as a promising material for advanced interposers in 2.5-D and 3-D integration. In this paper, through glass vias (TGVs) are used to implement inductors for minimal footprint and large quality factor. Based on the proposed physical structure, the impact of various process and design parameters on the electrical characteristics of TGV inductors is investigated with 3-D electromagnetic simulator HFSS. It is observed that TGV inductors have identical inductance and larger quality factor in comparison with their through silicon via counterparts. Using TGV inductors and parallel plate capacitors, a compact 3-D band-pass filter (BPF) is designed and analyzed. Compared with some reported BPFs, the proposed TGV-based circuit has an ultra-compact size and excellent filtering performance.