材料科学
铜
电阻率和电导率
复合材料
碳化硼
硼
抗弯强度
碳纤维
润湿
兴奋剂
电阻和电导
接触电阻
冶金
复合数
化学
光电子学
有机化学
图层(电子)
电气工程
工程类
作者
Haozi Zuo,Wenfu Wei,Zefeng Yang,Xiaobo Li,Junwen Ren,Yong Jun Xian,Qianhua Liao,Guofeng Yin,Guoqiang Gao,Guangning Wu
标识
DOI:10.1016/j.jallcom.2021.160213
摘要
The use of carbon/copper (C/Cu) composites as electrical contact materials has developed rapidly owing to their superior mechanical strength, electrical conductivity, and self-lubricity. However, the non-wettability of carbon and copper restricts further improvement in their performance. In this work, a strategy based on copper-boron alloying is proposed, to improve C/Cu interfacial bonding, and Cu-B/sintered-carbon composites were successfully prepared using a gas pressure impregnation technique. The results show that the compressive and flexural strengths of the modified composites increased by 39% and 54%, respectively, and the C/Cu contact angle decreased from 123.6° to 21.3° in the case of 2.5 wt% B doping. A minimum electrical resistivity of 1.7 μΩ·m was achieved when a moderate boron content (1.2 wt%) was selected. The role of boron carbide was examined, and competitive mechanisms of C/Cu interfacial bonding level and electrical conductivity are proposed, based on aspects of interfacial resistance and scattering of conducting electrons.
科研通智能强力驱动
Strongly Powered by AbleSci AI