High Ductility and Strength by Internal Interface Recrystallization of Cold Sprayed Zinc and its Fracture Behavior

材料科学 再结晶(地质) 微观结构 软化 极限抗拉强度 延展性(地球科学) 冶金 复合材料 动态再结晶 热加工 蠕动 地质学 古生物学
作者
Chunjie Huang,L. Wiehler,Alexander List,Andreas Elsenberg,F. Gärtner,Thomas Klassen,Banglong Fu,Ting Chen,Benjamin Klusemann,Zhengmao Zhang,Wenya Li
出处
期刊:Thermal spray 卷期号:84536: 250-257 被引量:2
标识
DOI:10.31399/asm.cp.itsc2023p0250
摘要

Abstract Tailoring strength and ductility in additive manufacturing or repair is key to successful applications. Therefore, cold spraying must be tuned for maximum amounts of well-bonded internal interfaces as well as sufficient softening of the highly workhardened deposit. Zinc (Zn) with its low melting temperature is an ideal model system to study phenomena associated with high strain rate deformation and local temperature distributions, both, in single impacts and thicker deposits. Bonding and recrystallization can be facilitated by covering selected wide parameter regimes in cold spraying. Despite the low temperatures, Zn single splats already show recrystallization at internal interfaces, the respective amounts then scaling with increasing process gas temperatures. At higher process temperatures, deposits are almost fully recrystallized. The recrystallization seems to improve bonding at internal and at deposit-substrate interfaces. Under optimum conditions, an ultimate deposit cohesive strength of up to 135 MPa and an elongation to failure of 18.4% are reached, comparable to that of laser-manufactured or bulk Zn parts. This demonstrates a welltuned interplay between high amounts of bonded interfaces and softening by recrystallization that allows for deriving bulk-like performance of cold sprayed material without additional posttreatments. Correlations between microstructures, mechanical properties, and fracture mechanisms supply information about prerequisites needed for reaching high ductility as obtained in damage and failure modes of deposits and bulk materials in global and local approaches.

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