插层(化学)
金属
材料科学
纳米技术
结晶学
无机化学
化学物理
凝聚态物理
化学
冶金
物理
作者
Tanner Q. Kimberly,Bob Wang,Michelle H. Frasch,Karen C. Bustillo,Dong Yu,Susan M. Kauzlarich
出处
期刊:Nano Letters
[American Chemical Society]
日期:2025-05-22
卷期号:25 (22): 9040-9046
标识
DOI:10.1021/acs.nanolett.5c01540
摘要
Thermoelectric materials are particularly relevant to the current energy infrastructure and demands of the 21st century, converting waste heat into usable electricity. The solution intercalation of zerovalent copper into Sb2Te3 nanoplates, a well-established thermoelectric material, is reported. The copper intercalant is homogeneously distributed throughout the nanoplates, confirmed by scanning transmission electron microscopy coupled with energy-dispersive X-ray spectroscopy. The copper composition was shown to be 6 at. % by X-ray photoelectron spectroscopy. Copper ordering within the van der Waals gaps of the nanoplates is confirmed by selected area electron diffraction. Fabrication and thermoelectric property measurements of single-crystal Sb2Te3 and Cu-Sb2Te3 nanoplate devices show effective modulation of electrical conductivity and Seebeck coefficient with Cu intercalation. X-ray photoelectron spectroscopic studies in the valence-band region reveal additional electronic states from copper that appear near the Fermi energy, postulated to act as electron acceptors, leading to modulation of the electronic transport properties.
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