Aging Behavior of PEEK, PTFE, and PI Insulation Materials Under Thermal Oxidative and Humid Conditions for Aerospace Applications

ABSTRACT Polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE), and polyimide (PI) are widely used in aerospace due to their excellent properties. Understanding their aging behavior is essential for long‐term performance in extreme environments. This study examines the effects of thermal oxidative aging (at 250°C over varying periods) under humid conditions on their chemical, structural, thermal, mechanical, and dielectric properties. In PEEK, aging led to solidification and crosslinking phenomenon which resulted in increased tensile strength and storage modulus, while elongation at break and tan δ decreased. Dielectric permittivity, polarization charge density, and leakage current also declined with aging, while AC breakdown strength increased by 1.6% in PEEK. PTFE exhibited surface oxidation, thermal degradation, and a decrease in storage modulus, with an increase in loss tangent. Breakdown strength slightly decreased, while dielectric loss and leakage current increased over aging time. PI underwent severe mechanical degradation, with tensile strength reduced by 54% and elongation by 16%, along with oxidation‐induced discoloration. Low‐mass polar molecules generated in PI during thermal degradation which contributed to the deterioration of its dielectric properties, lead to increased permittivity, polarization, leakage current, and a lower breakdown strength observed after aging. These findings provide insights into degradation mechanisms, aiding aerospace material selection for extreme environments.