A Universal, High‐Fidelity and Efficient Approach for Nanostructure Transfer and Exfoliation via a Polymeric Carrier

Abstract Low‐dimensional nanomaterials including 0D nanoparticles, 1D nanowires, and 2D nanosheets, have attracted significant research interest due to their unique properties arising from quantum confinement effects. The artificial assembly of hybrid dimensional structures, including 0D‐2D, 1D‐2D, and 2D–2D nanostructures such as van der Waals heterojunctions and twist systems, provides ideal platforms for both fundamental research and practical application. However, conventional transfer‐based assembly methods present several limitations, including the requirement for high‐temperature processing, specific environmental conditions, introduction of impurities and structural defects, as well as low production yield, which hinder their widespread application in nanodevice fabrication. Consequently, a new and more competent alternative is highly sought. To address these challenges, a novel approach is developed using polyvinyl butyral (PVB) as a universal transfer medium for nanostructures of various dimensionalities onto diverse substrates. This method achieves high transfer yield while maintaining structural fidelity, not only meets the pressing need for reliable nanostructure assembly but also expands the toolkit for constructing complex architectures, thereby facilitating fundamental research and enabling practical implementation of low‐dimensional materials in the next‐generation photonic and electronic devices beyond Moore's law.