异质结
材料科学
塞贝克系数
热电效应
碳化硅
光电子学
热导率
复合材料
热力学
物理
作者
Pablo Guzmán,Toan Dinh,Thanh Nguyen,Abu Riduan Md Foisal,Hung D. Nguyen,Quan Hong Nguyen,Tuan‐Khoa Nguyen,Hoang‐Phuong Phan,Philip Tanner,Peter Woodfield,Van Thanh Dau,Huaizhong Li,Nam‐Trung Nguyen,Dzung Viet Dao
标识
DOI:10.1016/j.mtcomm.2024.108493
摘要
The thermoelectric effect is important for thermal sensing, energy harvesting and other applications. This paper investigates the Seebeck coefficient of silicon carbide (SiC) on silicon (Si) heterojunctions and discusses the mechanism underlying the observed effects. The measured Seebeck coefficients of p‐3C‐SiC/p‐Si and n‐3C‐SiC/p‐Si heterojunctions are much higher than other reported values for SiC materials. The maximum Seebeck coefficients of p‐3C‐SiC/p‐Si and n‐3C‐SiC/p‐Si obtained were 1720 µV/K at 383 K and –421 µV/K at 396 K, respectively. These values are almost three times higher than those of other p-SiC and n-SiC materials. The high Seebeck coefficient in SiC/Si heterojunctions is attributed to the unique structure of the heterojunctions, which enables thermally activated charge carriers to migrate from Si to SiC. The results suggest that these heterojunctions can be exploited to develop highly sensitive self-powered thermal sensors.
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