材料科学
极限抗拉强度
压痕硬度
微观结构
复合材料
延伸率
断口学
搅拌摩擦加工
扫描电子显微镜
作者
Setu Suman,Durjyodhan Sethi,Uttam Acharya,Barnik Saha Roy
出处
期刊:Silicon
[Springer Science+Business Media]
日期:2023-12-28
卷期号:16 (5): 2219-2231
被引量:2
标识
DOI:10.1007/s12633-023-02827-3
摘要
This study investigates the temperature distribution behavior during friction stir Processing (FSP) of AA6061-T6 plates with varying SiC particle volume fractions (Vf). FSP have been conducted under consistent parameters: a tool rotational speed of 1100 rpm, tool traverse speed of 1.5 mm/s, and tool tilt angle of 2°. Temperature was monitored using K-type thermocouples inserted into the plates, providing a temperature distribution profile for variation in SiCp. Scanning electron microscopy and optical imaging was employed for surface morphology analysis. Mechanical properties such as ultimate tensile strength, yield stress, % elongation, microhardness, and fractography were examined. The findings revealed a continuous increase in temperature with Vf, peaking at 0.25% Vf (353.45 °C) and then decreasing at 0.3% Vf (295.66 °C). Microstructure analysis showed uniform SiCp distribution at 0.25% Vf. Similar trends were observed for ultimate tensile strength, yield strength, and microhardness, with maximum values of 341 MPa, 233 MPa, and 127 HV0.1, respectively, at 0.25% Vf. % elongation decreased with increasing Vf. These results contribute to the understanding of how SiCp reinforcement affects the FSW process and the resultant material properties.
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