微观结构
合金
电阻率和电导率
材料科学
降水
相(物质)
冶金
透射电子显微镜
压痕硬度
扫描电子显微镜
复合材料
原位
沉淀硬化
联轴节(管道)
散射
电导率
光学显微镜
作者
Xiang Li,Hongying Li,Haoqing Tang,Xiang Xiao,Jiaqiang Han,Ziqiao Zheng
出处
期刊:Materials
[Multidisciplinary Digital Publishing Institute]
日期:2023-12-03
卷期号:16 (23): 7492-7492
被引量:3
摘要
The microstructure evolution of 2196 Al-Li alloy during aging was investigated by microhardness test, transmission electron microscope (TEM) analysis and in situ resistivity measurement. The results showed that the resistivity of the 2196 Al-Li alloy during aging rapidly decreased during the first few hours, and then gradually increased after reaching the minimum value, which is temperature−dependent. The microstructure of the alloy was dominated by the δ′ phase after aging at 160 °C for 2 h while the T1 phase could hardly be seen until it had been aged for 16 h. As the aging time went on, significant ripening appeared for the δ′ phase while typical growth could be observed for the T1 phase. The increase in the resistivity of the 2196 Al-Li alloy during aging was attributed to the stronger electron scattering capacity of the T1 precipitation and the coupling effect between the T1 and δ′ phases.
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