Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductance and thermal resistance. Besides, the temperature at each point within the structure is closely related to its thermo–mechanical properties and device reliability. However, thermal resistance is limited in describing the temperature distribution. Finite element analysis (FEA) requires time-consuming construction of 3D models. Therefore, to depict the temperature distribution of FOPLP rapidly and accurately, a numerical heat transfer model was proposed for the double-sided package structure. The solution was obtained from the steady-state thermal balance Laplace equation using the separation of variables method. Several boundaries were analyzed to determine the specific parameters in the model. Finally, the temperature field predicted by the derived numerical model was compared with finite element simulation results. The proposed model was consistent with both Silicon (Si) and Silicon Carbide (SiC) FOPLP structures within the error of 15 % at the center of the device, which verified the validity and accuracy of the numerical model for double-sided heat dissipation. The proposed models and results could contribute to the development of effective thermal design tools for double-sided thermal power modules.