Heterogeneous and Chiplet Integration Using Organic Interposer (CoWoS-R)

Interposer technology is successfully adopted for heterogeneous and chiplet integration because of its advantages in electrical performance, warpage control, yield and reliability. Organic interposer (CoWoS-R) technology is one of the most promising new integration interposer platforms, providing low RC interconnect with good signal isolation and design scalability. New integrated de-cap capacitors suppress the power domain noise and enhance the HBM3 signal integrity at high data rate.