Interweaved filler network in epoxy resin with reduced interface thermal resistance via in-situ high-temperature “welding” for significantly improved thermal conductivity

For heterogeneous integration in harsh environments, polymeric materials are required to integrate excellent insulating property with significant thermal conductivity. Traditional discrete fillers used in polymeric matrix to create thermal pathways introduce numerous contact interfaces, leading to limited thermal conductivity enhancement efficiency (TCE) and unstable dielectric properties. Here, a distinctive strategy, involving the preparation of an interweaved thermally conductive filler with inherent heat channels through self-templated electrospinning and in-situ high-temperature "interface welding", is proposed to reduce the interface thermal resistance (ITR). The growth of grains at high temperature facilitates the process of "interface welding", while self-templated electrospinning establishes intrinsic thermal conduction pathways. Consequently, the epoxy resin fortified with this interweaved filler exhibits an exceptionally TCE of 162.15 % and enhanced in-plane thermal conductivity of 3.75 W m−1 K−1 at ultra-low filler ratio of 7.10 vol%. The combination of high electrical insulation of filler and low filler content results in excellent electrical insulating property (>1017 Ω cm) and stable dielectric properties over a frequency range of 103-106 Hz, enabling the successful implementation of heterogeneous integration in challenging environments. This work has the potential to offer a groundbreaking approach for achieving interconnected functional networks within polymer-based composites.