绝缘栅双极晶体管
沟槽
双极结晶体管
过程(计算)
电子工程
晶体管
材料科学
逻辑门
电气工程
MOSFET
电流注入技术
场效应晶体管
硅
计算机科学
电击穿
工程类
光电子学
半导体器件建模
等效电路
集成电路
半导体器件
功率半导体器件
温度测量
作者
Luping Li,Qiansheng Rao,Yuanzhen Yang,Zehong Li,Peng Chen,Haifeng Qin,Ming Li,Li Wan,Wei Li,Yuzhou Wu,Min Ren,Bo Zhang
标识
DOI:10.1109/ted.2025.3618520
摘要
A Multi-Epi-based 650-V/30-A trench field-stop carrier-storage superjunction-insulated gate bipolar transistor (CS-SJBT) is designed and experimentally presented in this work, whose cell structure, main process flow, and measured static/dynamic parameters are demonstrated. Advanced commercial trench/micropattern-trench (MPT) field-stop N-drift IGBT (NDBT) are comparatively measured to evaluate the performance improvement of SJ-pillar. Measured BV/ $\textit{V} _{\text {th}}$ / $\textit{V} _{\text {on}}$ / $\textit{J} _{\text {C}}$ of CS-SJBT are similar to commercial NDBTs; meanwhile, $\textit{t} _{\text {d,on}}$ / $\textit{t} _{\text {r}}$ / $\textit{E} _{\text {on}}$ / $\textit{t}_{\text {d,off}}$ / $\textit{t} _{\text {f}}$ / $\textit{E} _{\text {off}}$ of CS-SJBT are reduced from Trench-NDBT and approximate to MPT-NDBT under the effect of SJ-pillar. Overall, FOM of trench-SJBT is 2.8 times as trench-NDBT and 1.7 times as MPT-NDBT, respectively, which demonstrates that 45- $\mu $ m SJ-pillar in 650-V CS-IGBT can obtain no weaker $\textit{V} _{\text {on}}$ – $\textit{E} _{\text {on}}$ / $\textit{E} _{\text {off}}$ – $\textit{t} _{\text {sc}}$ tradeoff by reducing $\textit{E} _{\text {on}}$ / $\textit{E} _{\text {off}}$ than 1.6- $\mu $ m MPT by reducing $\textit{V} _{\text {on}}$ .
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