材料科学
钙钛矿(结构)
电阻随机存取存储器
光电子学
结晶度
氧化铟锡
图层(电子)
锡
卤化物
氧化锡
纳米技术
化学工程
电压
电气工程
无机化学
复合材料
工程类
兴奋剂
化学
冶金
作者
Ghulam Abbas,Muhammad Hassan,Qasim Khan,Haifei Wang,Guigang Zhou,Muhammad Zubair,Xiuru Xu,Zhengchun Peng
标识
DOI:10.1002/aelm.202101412
摘要
Abstract Inorganic perovskite‐based memory devices have attracted tremendous attention due to their higher level of stability, more feasible synthesis conditions and better performance, as compared to organic–inorganic hybrid perovskite‐based devices. However, better film morphology is an essential issue for the performance of these devices. Here, the all‐inorganic halide perovskite cesium lead bromide (CsPbBr 3 ) films are successfully fabricated via a unique solution processable deposition method at ambient conditions. These films possess satisfactory surface morphology with high crystallinity. These are utilized for reproducible resistive switching layers in the gold/CsPbBr 3 /indium tin oxide/Glass memory applications. A series of resistive switching layers (i.e., CsPbBr 3 ) with varied thicknesses in the range of 200–500 nm are precisely tailored. The resistive switching responses and retention properties of CsPbBr 3 based‐memory devices exhibit long‐term retention (exceeding 10000 s), high on/off ratio (up to 10000), low power consumption (set voltage at 0.25V), and good reproducibility. A model for the formation of filaments in the CsPbBr 3 layer is proposed to describe the resistive switching mechanism. Furthermore, the devices exhibit excellent transient behavior, which is beneficial for the security of data storage. These characteristics reveal that cesium lead halide based memristor is promising to be utilized as the next‐generation smart memory device.
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