串联
欧姆接触
材料科学
纳米技术
复合材料
图层(电子)
作者
Ning Li,Tobias Stubhan,Johannes Krantz,Florian Machui,Mathieu Turbiez,Tayebeh Ameri,Christoph J. Brabec
摘要
A solution-processed Ag nanostructure based thin layer is introduced to lift the recombination restrictions at the interface of the intermediate layer.
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