表面粗糙度
MATLAB语言
机械加工
磨料
机械工程
表面光洁度
线速
材料科学
钻探
钻石
曲面(拓扑)
金刚石切割
工程制图
金刚石车削
计算机科学
工程类
几何学
复合材料
数学
操作系统
作者
Ligang Zhao,Guofeng Xia,Shi Yu-hu,Aisheng Wu
标识
DOI:10.1108/ilt-07-2019-0247
摘要
Purpose The purpose of this paper is to study the influence of the processing parameters of diamond wire sawing on surface morphology and roughness. Design/methodology/approach First, a wire saw cutting model is established to determine the positional relationship between a wire saw and the machined surface of the workpiece, and the abrasive grain cutting trajectory is generated. Through the data processing of the cutting trajectory, the simulation of the three-dimensional surface topography of the slice and the calculation of the surface roughness are realized by using the GUI programming of MATLAB. Finally, different surface roughness values are obtained by changing the machining parameters (saw wire speed and workpiece feed speed). Findings The conclusion is that the surface roughness of the slice is larger when the feed speed is higher and smaller when the linear speed is higher. Originality/value Diamond wire saw cutting is the first process of chip processing, and its efficiency and quality have an important impact on subsequent processing. This paper will focus on the influence of the sawing wire cutting processing parameters (sawing wire speed and workpiece feed speed) on the surface roughness to optimize the processing parameters and obtain smaller surface roughness values. Through MATLAB three-dimensional simulation, the surface morphology can be observed more intuitively, which provides a theoretical basis for improving the processing quality.
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