钝化
材料科学
硅
蚀刻(微加工)
棱锥(几何)
表面粗糙度
各向同性腐蚀
晶体硅
表面光洁度
纳米技术
结晶学
光电子学
光学
化学
物理
复合材料
图层(电子)
作者
Abhijit S. Kale,William Nemeth,Harvey L Guthrey,Matthew Page,Mowafak M. Al-Jassim,David L. Young,Sumit Agarwal,Paul Stradins
标识
DOI:10.1109/jphotov.2019.2937230
摘要
High-efficiency crystalline silicon (c-Si) solar cells require textured surfaces for efficient light trapping. However, passivation of a textured pyramidal surface to reduce carrier recombination is challenging due to the presence of sharp tips, edges, and valleys. Using electrical and surface microscopies combined with lifetime measurements, we report on the effect of HF:HNO3etching on the pyramidal textured Si surface morphology, and on poly-Si/SiOxcontact performance. Preferential rounding of either the valleys between pyramids, or the pyramid tips is obtained depending on the HF:HNO3solution temperature. Both these morphologies make the pyramid shape irregular, with the pyramid faces no longer being predominantly a Si(111) surface. Our atomic force microscopy measurements further show that the nanoscale roughness over the pyramid face also reduces after HF:HNO3etching. Thus, etching affects the microscopic pyramidal shape, the dominant crystallographic orientation, and the nanoscale roughness of the surface. We speculate that these three surface effects result in the improvement of surface passivation via poly-Si/SiOxcontacts. However, this improved passivation is accompanied by increased reflectance of the HF:HNO3-etched textured surface. Finally, our electron-beam-induced current measurements reveal thickness nonuniformities in the thermally grown SiOxlayer on the HF:HNO3-etched textured Si surface: SiOxis thicker near the pyramid tips, edges, and faces as compared with near the valleys between pyramids. This nonuniformity in the SiOxlayer may explain the poorer passivation obtained on a KOH-textured and HF:HNO3-etched textured surface as compared with a planar surface.
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