Study on the Growth and Properties of Electrolessly Deposited Thin Copper Coatings on Epoxy-Based CFRP

In this study, copper coatings smaller than 3 µm were created by electroless deposition on epoxy-based carbon fiber-reinforced polymer (CFRP) laminates for enhancing their electrical properties. This well-known method of metallization was employed with a self-designed combination of reagents, and the coatings were studied to evaluate their physical and chemical properties. A five-stage plating strategy was applied to 40 mm × 40 mm samples, and three different coatings were produced during the work. The metal layers created were studied and characterized to evaluate their, electrical conductivity, thickness, and adhesion to substrates, among other properties. In addition, the growth mechanisms of the microstructure were analyzed in detail for a better understanding of the process. The results showed that the proposed metallization strategy presents good characteristics and is a strong candidate for enhancing the electrical performance of CFRP.